View ATATSAMB11-MR210CA_8917923.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

atsamb11 - mr210ca/mr510ca ultra low power ble 4.1 module datasheet description the atmel ? atsamb11 - mr210ca is an ultra - low power bluetooth ? smart (ble 4.1) module with integrated mcu, transceiver, modem, mac, pa, tr switch, and power management unit (pmu ). it is a standalone cortex ? - m0 applicatio ns processor with embedded flash memory and ble connectivity. the qualified bluetooth smart protocol stack is stored in dedicated rom, the firmware includes l2cap service layer protocols, security manager, attribu te protocol (att), generic attribute profile (gatt) , and the generic access profile (gap). additionally, application profiles such as proximity, thermometer, heart rate, blood pressure , and many others are supported and included in the protocol stack. the module contains all circuitry required including a ceramic high gain antenna, 26mhz crystal , and pmu circuitry. the customer simply needs to place the module on the customer pcb design , provide power and a 32 khz real time clock or crystal. all referen ces to atsamb11 - mr210ca, refer to the atsamb11 - mr510 ca as well. features ? complies with bluetooth v4.1, etsi en 300 328 and en 300 440 class 2, fcc cfr47 part 15 , and arib std - t66 ? bluetooth certification C qd id controller (see declaration d028678 ) C qd id host (see declaration d028679 ) ? 2.4ghz transceiver and modem C - 95dbm/ - 93dbm pr ogrammable receiver sensitivity C - 20 to +3 .5 dbm programmable tx output power C integrated t/r switch C incorporated antenna ? arm ? cortex ? - m0 32 - bit processor C single wire debug (swd) interface C four - channel dma controller C brown - out detector and power on reset C watch dog timer ? memory C 128 k b embedde d ram (96 k b available for application) C 128 k b embedded rom C 256 k b stacked f l ash memory ? hardware security accelerators C aes - 128 atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 2 C sha - 256 ? peripherals C 23 digital and three wakeup gpio with 9 6k? internal pullup resistors, four mixed signal gpio C 2x spi (master/slave) C 2x i 2 c (master/slave) C 2x uart C 1x spi flash C 3 - a xis quadrature decoder C 4x pulse width modulation (pwm), three general purpose timers , and one w ake up timer C four channel 11 - bit adc ? cl ock C integrated 26mhz oscillator C 26mhz crystal oscillator C fully integrated sleep oscillator ? ultra - l ow power C less than 1.1 a sleep current (8k ram retention and rtc running) C 3.2ma peak tx current (0dbm, 3.6v) C 5.0ma peak rx current (3.6v, - 95dbm sensitivity) ? integrated power management C 2 .3 - 4.2 v input range for pmu C 2.3 - 3.6v input range for i/o (limited by f lash memory) C fully integrated buck dc - dc converter
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 3 3 table of contents 3 block diagram ................................ ................................ ................................ ............. 5 4 pin out information ................................ ................................ ................................ ..... 6 4.1 pin assignment ................................ ................................ ................................ ................................ ..... 6 4.2 pin description ................................ ................................ ................................ ................................ ...... 7 4.3 module outline drawing ................................ ................................ ................................ ........................ 9 5 electrical specifications ................................ ................................ ........................... 10 5.1 absolute maximum ratings ................................ ................................ ................................ ................. 10 5.2 recommended operating conditions ................................ ................................ ................................ . 10 5.3 restrictions for the power states ................................ ................................ ................................ ........ 10 5.4 power - up sequence ................................ ................................ ................................ ............................ 11 5.5 rtc pins ................................ ................................ ................................ ................................ ............. 11 6 characteristics ................................ ................................ ................................ ........... 12 6.1 device states ................................ ................................ ................................ ................................ ...... 12 6.2 receiver performance ................................ ................................ ................................ ......................... 13 6.3 transmitter performance ................................ ................................ ................................ ..................... 14 7 application schematic ................................ ................................ .............................. 15 7.1 application schematic ................................ ................................ ................................ ......................... 15 7.2 applications schematic with 3 2.768khz crystal ................................ ................................ .................. 16 7.3 application schematic bom ................................ ................................ ................................ ................ 17 8 placement and routing guidelines ................................ ................................ .......... 18 8.1 power and ground ................................ ................................ ................................ .............................. 19 8.2 interferers ................................ ................................ ................................ ................................ ............ 19 9 reflow profile information ................................ ................................ ........................ 20 9.1 storage conditions ................................ ................................ ................................ .............................. 20 9.1.1 moisture barrier bag before opened ................................ ................................ ..................... 20 9.1.2 moisture barrier bag o pen ................................ ................................ ................................ ..... 20 9.2 stencil design ................................ ................................ ................................ ................................ ..... 20 9.3 baking conditions ................................ ................................ ................................ ............................... 20 9.4 soldering and reflow condition ................................ ................................ ................................ .......... 20 9.4.1 reflow oven ................................ ................................ ................................ ........................... 20 9.5 module assembly considerations ................................ ................................ ................................ ....... 21 10 reference documentation and support ................................ ................................ ... 22 10.1 reference documents ................................ ................................ ................................ ......................... 22 11 certifications ................................ ................................ ................................ ............. 23 11.1 agency compliance ................................ ................................ ................................ ............................ 23 12 errata ................................ ................................ ................................ .......................... 24 13 document revision history ................................ ................................ ...................... 25
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 4 4 1 ordering information ordering code package description at atsamb11 - mr210ca 22 x 15mm chip antenna at atsamb11 - mr510ca 22 x 15mm chip antenna the at atsamb11 - mr510ca module is identical to at atsamb11 - mr210ca regarding the module footprint and functionality. the at atsamb11 - mr510ca also includes the capability of hardware encryption. 2 package information table 2 - 1. at atsamb11 - mr210/ mr 510 m odule information (1) pa rameter value units tolerance package size 22.88 x 15.36 mm pad count 40 total thickness ~ 2.1 mm pad pitch 0 .9002 pad width 0 .500 exposed pad size 4.4 x 4.4 note: 1. for details, see package drawing in section 4.3 .
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 5 5 3 block diagram the following image s hows the block diagram of the atsamb11 - mr210ca /mr510 module. figure 3 - 1. block diagram samb 11 ble 4 . 1 soc matching vddio vbat chip _ en lp _ gpio ao _ gpio _ 0 / 1 / 2 antenna 26 mhz from 32 . 768 khz crystal or clock gpio _ ms 1 / ms 2 / ms 3 / ms 4
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 6 6 4 pin out information 4.1 pin assignment the following image s hows the module top view and pin numbering. figure 4 - 1. atsamb11 - mr210 pin assignments atsamb 11 - mr 210 ca module p 27 p 28 p 29 p 30 p 31 p 32 p 33 p 34 p 35 p 36 p 37 p 38 p 39 p 10 p 2 p 3 p 4 p 5 p 6 p 7 p 8 p 1 p 9 p 11 p 12 p 13 p 23 p 15 p 16 p 17 p 18 p 19 p 20 p 21 p 14 p 22 p 24 p 25 p 26 atmel corp . atsamb 11 _ mr 210 ca rev ___
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 7 7 4.2 pin description table 4 - 1. pin description # name type description notes 1 ground power grou nd pin. connect to pcb ground 2 lp_gpio_0 i/o u sed for single wire debug clock debug interface pin. connect to a header or test point . 3 lp_gpio_1 i/o used for single wire debug data debug interface pin. connect to a header or test point . 4 vbat power power supply pin for the on chip power managem ent unit (pmu). connect to a 2.35 v C 4.3v power supply. 5 lp_gpio_2 i/o general purpose i/o de fault function is host uart rxd 6 lp_gpio_3 i/o general purpose i/o de fault function is host uart txd 7 lp_gpio_ 4 i/o general purpose i/o de fault function is host uart cts 8 lp_gpio_22 i/o general purpose i/o 9 lp_gpio_23 i/o general purpose i/o 10 lp_gpio_5 i/o general purpose i/o de fault function is host uart rts 11 lp_gpio_6 i/o general purpose i/o d efault function is debug uart rx d 12 lp_gpio_7 i/o general purpose i/o d efault function is debug uart tx d 13 lp_gpio_8 i/o general purpose i/o default function is i2c_sda 14 ground power ground pin. connect to pcb ground . 15 lp_gpio_9 i/o general purpose i/o default function is i2c_scl 16 lp_gpio_10 i/o general purpose i/o default function is spi_sck 17 lp_gpio_11 i/o general purpose i/o default function is spi_mosi 18 lp_gpio_12 i/o general purpose i/o default function is spi_ssn 19 lp_gpio_13 i/o genera l purpose i/o default function is spi_miso 20 gpio_ms1 i/o mixed signal i/o configu rable to be a gpio or adc input 21 gpio_ms2 i/o mixed signal i/o configu rable to be a gpio or adc input 22 chip_en con- trol chip enable. a high level turns on the on chip pmu and enables oper- ation of the device. low disables the device and turns off the pmu. control this pin with a host gpio. if not used, tie to vddio . 23 gpio_ms3 i/o mixed signal i/o configu rable to be a gpio or adc input 24 gpio_ms4 i/o mixed signal i/o configu rable to be a gpio or adc input 25 rtc_clkp positive pin for real time clock crystal connect to a 32 khz crystal 26 ground power ground pin. connect to pcb ground . 27 rtc_clkn negative pin for real time clock crystal connect to a 32 khz crystal 28 ao_gpio_0 i/o always on gpio_0. can be used to wake up the device from sleep. can also be used as a general purpose i/o. 29 ao_gpio_1 i/o always on gpio_0. can be used to wake up the device from sleep. can also be used as a general purpose i/o.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 8 8 # name type description notes 30 ao_gpio_2 i/o always on gpio_0. can be used to wake up the device from sleep. can also be used as a general purpose i/o. 31 lp_gpio_14 i/o general purpose i/o default function is debug i2c_sda 32 vddio power power supply pin for the i/o pins. connect t o a 2.3v C 3.6v power supply. i/o supply can be less than or equal to vbat 33 lp_gpio_15 i/o general purpose i/o default function is debug i2c_scl 34 lp_gpio_16 i/o general purpose i/o 35 lp_gpio_17 i/o general purpose i/o 36 lp_gpio_18 i/o general p urpose i/o 37 lp_gpio_19 i/o general purpose i/o 38 lp_gpio_20 i/o general purpose i/o 39 ground power ground pin. connect to pcb ground . 40 paddle power center ground paddle connect to inner pcb ground plane with an array of vias
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 9 9 4.3 module outline drawing the following figure shows the bottom view of the module and the module dimensions. all dimensions are in m illimeters . figure 4 - 2. atsamb11 - mr210ca module dime nsions (m illimeters) figure 4 - 3. atsamb11 - mr210ca customer pcb footprint p 5 p 4 p 3 p 2 p 1 p 9 p 8 p 7 p 6 p 13 p 12 p 11 p 10 p 35 p 36 p 37 p 38 p 39 p 31 p 32 p 33 p 34 p 27 p 28 p 29 p 30 p 1 p 39 top view bottom view shield 15 . 367 15 . 286 22 . 885 13 . 866 2 . 222 2 . 345 1 . 266 0 . 900 pitch 4 . 400 0 . 70 typ 0 . 50 typ 4 . 400 5 . 606 6 . 224 4 . 743 note : this pad must be soldered to gnd . p 14 p 15 p 16 p 17 p 18 p 19 p 20 p 21 p 22 p 23 p 24 p 25 p 26 dimension units : mm drawing not to scale untoleranced dimensions side view pcb shield 1 . 295 0 . 787 2 . 082 atsamb 11 - mr 210 ca solder pad footprint top view note : this pad m ust be tie d to gn d . 15 . 367 0 . 90 pitch 1 . 50 typ 0 . 50 typ 16 . 70 4 . 400 4 . 400 6 . 224 5 . 606 4 . 743 2 . 222 2 . 345 p 1 1 . 266 p 39
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 0 10 5 electrical specifications 5.1 absolute maximum ratings the values listed in this section are ratings that can be peaked by the device, but not sustained without causing irreparable d amage to the device. table 5 - 1. atsamb11 - mr210ca absolute maximum ratings symbol characteristic min . max . unit vddio i/o supply voltage - 0.3 4.2 v vbat battery supply voltage - 0.3 5.0 v in (1) digital input voltage - 0.3 vddio v ain (2) analog input voltage - 0.3 1.5 v esdhbm (3) esd human body model - 1000, - 2000(see notes below) +1000, +2000(see notes below) t a storage temperature - 65 150 o c junction temperature 125 note: 1. v in corresponds to all the digital pins . 2. v ain corresponds to the following analog pins: rfi o . 3. for v esdhbm , each pin is classified a s class 1, or class 2, or both: ? the class 1 pins include all the pins (both analog and digital) ? the class 2 pins include all digital pins only ? v esdhbm is 1kv for class1 pins. v esdhbm is 2kv for class2 pins 5.2 recommen ded operating conditions table 5 - 2. atsamb11 - mr210ca recommended operating conditions symbol characteristic min . typ . max . units vddio i/o supply voltage low range 2.3 3.3 3.6 v vbat battery supply voltage (1) 2.3 3.6 4.3 operating temperature - 40 85 o c note: 1. vbat supply must be greater than or equal to vddio . 5.3 restrictions for the power states when vddio is off (either disconnected or at ground potential), a voltage must not be applied to the device pins. this is because each pin contains an esd diode from the pin t o the vddio supply. this diode will turn on when a voltage higher than one diode - drop is supplied to the pin. this , in turn, will try to power up the part through the vddio supply. if a voltage must be applied to the signal pads while the chip is in a low power state, the vddio supply must be on. similarly, to prevent the pin - to - ground diode from turning on, do not apply a voltage that is more than 0.3v below ground to any pin.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 1 11 5.4 power - u p sequence the power - up/down sequence for atsamb1 - mr210a is shown in figure 5 - 1 . the timing parameters are provided in table 5 - 3 . figure 5 - 1. power - u p sequence table 5 - 3. power - up sequence timing parameter min . max . units description notes t bio 0 ms vbat rise to vddio rise vbat and vddio can rise simulta neously or can be tied together t ioce 0 vddio rise to chip_en rise chip_en must not rise before vddio. chip_en must be driven high or low, not left floating 5.5 rtc pins module pins 25 and 27 (rtc_clkp and rtc_clkn, respectively) are used for a 32.768k hz crystal. to be compliant with the ble specifications for connection events, the frequency accuracy of this clock has to be within 500ppm. because of the high accuracy of the 32.768kh z crystal oscillator clock ( 25ppm), the power consumption can be minimized by leaving radio circuits in low power sleep mode for as long as possible until they need to wake up for the next connection timed event. the block diagram in figure 5 - 2 (a) shows how the internal low - frequency crystal oscillator (xo) is con nected to the external crystal. typically, the crystal should be chosen to have a load capacitance of 7pf to minimize the oscillator current. the atsam b11 - mr210ca device has switchable on chip capacitance that can be used to adjust the total load the crystal sees to meet its loa d capacitance specification. r efer to the atsamb11 - 2100a datasheet for more information. alter natively, if an external 32.768k hz clock is available, it can be used to drive the rtc_clkp pin instead of using a crystal. the xo has 5.625f internal capacitance on the rtc_clkp pin. to bypass the crystal oscillator an external signal capable of driving 5.625pf can be applied to the rtc_c lk_p terminal as shown in figure 5 - 2 ( b). this signal must be 1.2v maximum. rtc_clk_n must be left unconnected when driving an external source into rtc_clk_p. v b a t t v d d i o c h i p _ e n t b i o t i o c e
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 2 12 figure 5 - 2. atsamb11 - mr210ca xo connections to low - frequency crys tal oscillator (a) crystal oscillator is used (b) c rystal oscillator is bypassed table 5 - 4. atsamb11 - mr210ca 32.768k hz ext ernal clock specification parameter min . typ . max . unit . comments oscillation frequenc y 32.768 k hz must be able to drive 6pf load @ desired frequency vinh 0.7 1.2 v high level input voltage vinl 0 0.2 v low level input voltage stability C temperature - 500 + 500 ppm 6 characteristics 6.1 device states table 6 - 1. atsamb11 - mr210ca device states device state chip_en vddio i vbat (typical) i vddio (typical) remark power_down gnd on <0.0 5 a <0.0 5 a chip enable off ultra low power on on 1.25 a 0.1 a with 8 kb retention memory, ble timer and rtc enabled ble_on_receive @ - 94dbm on on 4.5 ma 1 2 a vbat = 3.6v bl e_on_transmit , 0dbm output power on on 3. 0 ma 1 2 a vbat = 3.6v ble_on_transmit , 3.5 dbm output power on on 4 . 0 ma 1 2 a vbat = 3.6v ( a ) rtc _ clk _ p rtc _ clk _ n ( b ) rtc _ clk _ p rtc _ clk _ n external clock
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 3 13 6.2 receiver performance table 6 - 2. atsamb11 - mr210ca receiver performance parameter unit min . typ . (1) max . frequency mhz 2,402 - 2,480 se nsitivity with on - chip dc/dc dbm - 94.5 - 95 maximum receive signal level dbm 5 cci db 13 aci (n1) db 0 n+2 blocker (image) db - 20 n - 2 blocker db - 38 n+3 blocker (adj. image) db - 35 n - 3 blocker db - 43 n4 or greater db - 45 intermod (n+3, n+6) dbm - 33 oob (2ghz atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 4 14 6.3 transmitter performance table 6 - 3. atsamb11 - mr210ca transmitter performance parameter unit min . typ . max . frequency mhz 2,402 2,480 output power range dbm - 20 3.5 in - band spuri ous (n2) dbm - 40 in - band spurious (n3) dbm - 50 2 nd harmonic pout dbm - 41 frequency dev khz 250 all measurements performed at 3.6v v bat and 25 c, with tests following bluetooth v4.1 standard tests . average advertising current for connectable beacon with a full payload (37 - byte packet) is targeted to be 9.7 a . the average advertising current is based on automatic advertising from the rom with rtc 32khz, ble sleep timers, and 8kb memory retenti on. idram1 and idram2 are off. external peripherals and debug clocks are turned off. vbat is set to 3.6v. this advertising current will be enabled i n a future sdk release. for current sdk based advertising current, see errata chapter 12 .
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 5 15 7 application schematic the atsamb11 - mr210/ mr 510ca module s are fully self - contained . to use the module, just provide vbat and vddio supplies. figure 7 - 1 and figure 7 - 2 shows a typical design using the atsamb11 - mr210/ mr 510c a module s . the schematic shows several host interfaces: uart, i 2 c , and spi as well as an input to the adc on the gpio_ms1 pin. a user can choose the interface(s) required for their application. if a 32.768k hz real time clock is not available in the system, a 32.768 khz crystal can be used. section 7.2 shows a design using a crystal for the real time clock. the crystal should be specified with a load capacitance, c l =7pf and a total frequency error of 200ppm. table 7 - 1 shows the bom for the application schematics. note: the uart rts and uart cts are used for hardware flow control; they must be connected to the host mcu uart and enabled for the uart interface to be functional. module design info rmation such as module schematics can be obtained under an nda from atmel. 7.1 application schematic figure 7 - 1. application schematic vbat swdio swclk u1 samb11-mr210ca gnd1 1 lp_gpio_0 2 lp_gpio_1 3 vbat 4 lp_gpio_2 5 lp_gpio_3 6 lp_gpio_4 7 lp_gpio_22 8 lp_gpio_23 9 lp_gpio_5 10 lp_gpio_6 11 lp_gpio_7 12 lp_gpio_8 13 gnd2 14 lp_gpio_9 15 lp_gpio_10 16 lp_gpio_11 17 lp_gpio_12 18 lp_gpio_13 19 gpio_ms1 20 gpio_ms2 21 chip_en 22 gpio_ms3 23 gpio_ms4 24 paddle 40 rtc_clkp 25 gnd3 26 rtc_clkn 27 ao_gpio_0 28 ao_gpio_1 29 ao_gpio_2 30 lp_gpio_14 31 vddio 32 lp_gpio_15 33 lp_gpio_16 34 lp_gpio_17 35 lp_gpio_18 36 lp_gpio_19 37 lp_gpio_20 38 gnd4 39 gpio_ms1 vddio tp1 tp2 test points for atmel use uart_rxd uart_txd chip_en irqn/wake adc_in spi_mosi spi_miso spi_ssn spi_sck uart_rts uart_cts 32.768 khz (1.2v max.) c1 10uf if wake f unction is not used, connect ao_gpio_0 to ground
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 6 16 7.2 applications schematic with 32.768khz crystal figure 7 - 2. application schematic wit h 32.768k hz crystal vbat swdio swclk u1 samb11-mr210ca gnd1 1 lp_gpio_0 2 lp_gpio_1 3 vbat 4 lp_gpio_2 5 lp_gpio_3 6 lp_gpio_4 7 lp_gpio_22 8 lp_gpio_23 9 lp_gpio_5 10 lp_gpio_6 11 lp_gpio_7 12 lp_gpio_8 13 gnd2 14 lp_gpio_9 15 lp_gpio_10 16 lp_gpio_11 17 lp_gpio_12 18 lp_gpio_13 19 gpio_ms1 20 gpio_ms2 21 chip_en 22 gpio_ms3 23 gpio_ms4 24 paddle 40 rtc_clkp 25 gnd3 26 rtc_clkn 27 ao_gpio_0 28 ao_gpio_1 29 ao_gpio_2 30 lp_gpio_14 31 vddio 32 lp_gpio_15 33 lp_gpio_16 34 lp_gpio_17 35 lp_gpio_18 36 lp_gpio_19 37 lp_gpio_20 38 gnd4 39 gpio_ms1 vddio tp1 tp2 test points for atmel use uart_rxd uart_txd chip_en irqn/wake adc_in spi_mosi spi_miso spi_ssn spi_sck uart_rts uart_cts c1 10uf if wake f unction is not used, connect ao_gpio_0 to ground y1 32.768khz y 1 should be specif ied f or cl=7pf
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 7 17 7.3 application schematic bom table 7 - 1. applica tion schematic bom item qty. ref. value description manufacturer part # 1 1 c1 10 f cap,cer,10 f,20%,x5r,0603,6.3v panasonic eci - 1vb0i106m 2 2 tp1, tp2 test point 3 1 u1 atsamb11 - mr210ca module, ble, atsamb11 atmel atsamb11 - mr210ca 4 1 y1 32.768 khz xtal, 32.768 khz , 20ppm, - 40 to +85 c, cl=7pf, 2 lead, sm ecs ecs - .327 - 7 - 34b - tr
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 8 18 8 placement and routing guidelines it is critical to follow the recommendations listed below to achieve the best rf performance: 1. the board should have a solid ground plane. the center ground pad of the device must be soldered to the ground plane by using a 3 x 3 grid of vias (see figure 4 - 2 ). each ground pin of the at samb11 - mr210ca should have a ground via placed either in the pad or right next to the pad going down to the ground plane. 2. when the module is placed on the customer pcb design, a provision for the antenna must be made. there should be nothing under the portion of the module, which contains the antenna. this means the antenna should not be placed directly on top of the customer pcb as shown in figure 8 - 1 (a). this can be accomplished by, for example, placing the module at the edge of the board such that the module edge with the antenna extends beyond the custom er pcb edge by 6.5mm as shown in figure 8 - 1 (b). alternatively, a cutout in the customer pcb can be provided under the antenna. the cutout should be at least 22mm x 6.5mm (see figure 8 - 1 ( c) and figure 8 - 2 ). if the cutout method is used, the samb11 - mr210ca should be centered in the cutout. the samb11 - mr210ca must have ground vias spaced 2.5mm apart that should be placed all around the perimeter of the cutout. no large com ponents should be placed near the antenna. 3. keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking 4. do not enclose the antenna within a metal shield 5. keep any components that may radiate noise or signals withi n the 2.4ghz C 2.5ghz frequency band far away from the antenna or better yet, shield the components that are generating the noise. any noise radiated from the customer pcb in this frequency band will degrade the sensitivity of the samb11 - mr210ca module. figure 8 - 1. samb11 - mr210ca placement reference (a ) ( b ) ( c ) poor case best case acceptable case worst case system ground plane atmel atmel atmel atmel
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 1 9 19 figure 8 - 2. no pcb/gnd cut out area 8.1 power and ground dedicate one layer as a ground plane. make sure that this ground plane does not get broken up by routes. power can rou te on all layers except the ground layer. power supply routes should be heavy copper fill planes to e nsure the lowest possible inductance. the power pins of the module should have a via directly to the power plane as close to the pin as possible. decouplin g capacitors should have a via right next to the capacitor pin and this via should go directly down to the power plane C that is to say, the capacitor should not route to the power plane through a long trace. the ground side of the decoupling capacitor sho uld have a via right next to the pad which goes directly down to the ground plane. each decoupling capacitor should have its own via directly to the ground plane and directly to the power plane right next to the pad. the decoupling capacitors should be pla ced as close to the pin that it is filtering as possible. 8.2 interferers one of the biggest problems with rf receivers is poor performance due to interferers on the board radiating noise into the antenna or coupling into the rf traces going to input lna. care must be taken to make sure that there is no noisy circuitry placed anywhere near the antenna or the rf traces. all noise generating circuits should also be shielded so they do not radiate noise that is picked up by the antenna. also, make sure that no tra ces route underneath the rf portion of the samb11 - mr210ca . also, make sure that no traces route underneath any of the rf traces from the antenna to the samb11 - mr210ca input. this applies to all layers. even if there is a ground plane on a layer between the rf route and another signal, the ground return current will flow on the ground plane and b e couple d into the rf traces. atmel no pcb area cut out 6 . 5 mm 22 mm samb 11 module
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 0 20 9 reflow profile information this section provides guidelines for reflow processes in getting the atmel module sold ered to the customers design. 9.1 storage conditions 9.1.1 moisture barrier bag before opened a moisture barrier bag must be stored in a temperature of less than 30c with humidity under 85% rh. the calculated shelf life for the dry - packed product shall be 12 months from the date the b ag is sealed. 9.1.2 moisture barrier bag open humidity indicator cards must be blue, < 30%. 9.2 stencil design the recommended stencil is laser - cut, stainless - steel type with a thickness of 100m to 130m and approximately a 1:1 ratio of stencil opening to pad dimens ion. to improve paste release, a positive taper with bottom opening 25m larger than the top can be utilized. local manufacturing experience may find other combinations of stencil thickness and aperture size to get good results. 9.3 baking conditions this modu le is rated at msl level 3. after sealed bag is opened, no baking is required within 168 hours so long as the devices are held at 30 c/60% rh or s tored at <10% rh. the module will require baking before mounting if: ? the sealed bag has been open for >168 ho urs ? humi dity indicator card reads >10% ? sips need to be baked for 8 hours at 125 c 9.4 soldering and reflow condition 9.4.1 reflow oven it is strongly recommended that a reflow oven equipped with more heating zones and nitrogen atmosphere be used for lead - free assemb ly. nitrogen atmosphere has shown to improve the wet - ability and reduce temperature gradient across the board. it can also enhance the appearance of the solder joints by reducing the effects of oxidation. the following items should also be observed in the reflow process: 1. some recommended pastes include : C nc - smq ? 230 flux and indalloy ? 241 solder paste made up of 95.5 sn/3.8 ag/0.7 cu C senju n705 - grn3360 - k2 - v type 3, no clean paste. 2. allowable reflow soldering iterations : C three times based on the followin g reflow soldering profile ( as shown in figure 9 - 1 ). 3. temperature profile: C reflow soldering shall be done according to the following temperature profile ( as shown in figure 9 - 1 ). C peak temp erature : 250c.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 1 21 figure 9 - 1. solder reflow profile 9.5 module assembly considerations the atsamb11 - mr210 and atsamb11 - mr510 modules are assembled with an emi shield to ensure compliance with emi emission and immunity rules. the emi shield is made of a tin - plated steel (spte) and is not hermetically sealed. solutions like ipa and similar solvents can be used to clean the atsamb11 - mr210 or atsamb11 - mr510 . however, cleaning solutions, which contain acid, sho uld never be used on the module. the atsamb11 - mr21 0 and atsamb11 - mr510 modules are manufactured without a ny conformal coating applied. it is the customers responsibility if a conformal coating is specified and applied to the atsamb11 - mr210 or atsamb11 - mr510 module. 25 o c slope : 1 ~ 2 o c / sec max . ( 217 o c to peak ) ( peak : 250 o c ) ramp down rate : max . 2 . 5 o c / sec . time ( sec ) 40 ~ 70 sec . 60 ~ 120 sec . ramp up rate : max . 2 . 5 o c / sec . preheat : 150 ~ 200 o c 217 o c
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 2 22 10 reference documentation and support 10.1 r eference documents atmel offers a set of collateral documentation to ease integration a nd device ramp. the following table l is t documents available on atmel web site or integrated into development tools. table 10 - 1. reference documents title content datasheet this document atsamb11 soc datasheet data sheet for the atsamb11 soc contained on this module . ultra low power ble 4.1 soc - hard- war e design guidelines atsamb11 hardware design guide with r eferences for placement and rout- ing, external rtc, restrictions on power states, type of information. atbtlc1000 blusdk release pack- age this package contains the software development kit and al l the necessary documentation including getting started guides for interacting with different hardware devices, device drivers and api call references. for a complete listin g of development support tools and documentation, visit http://www.atmel.com/ , or contact the nearest atmel field representative.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 3 23 11 certifications 11.1 agency compliance the at atsamb11 - mr2 10ca has been tested and certified to meet the compliance for the following agencies: ? bluetooth 4.1 C the atsamb1 1 - mr210 utilizes the atbtlc1000 bluetooth die f or bluetooth operation. r efer to these qd id reference number s for bluetooth certifications. C qd id controller (see declaration d028678 ) C q d id host: (see declaration d028679 ) ? fcc C fcc id: 2adhksamb11 ? cfr47 part 15 ? etsi C en 300 328 C en 300 400 class 2 ? ari b C std - t66
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 4 24 12 errata issue: in the atsamb11 datasheet, the measured advertisement current for the cases listed in table 6 - 3 will be higher than what is reported. sdk5.0 does not resemble the same conditions where table 6 - 3 has been measured. for example : ? the power and timing parameters in the sdk5.0 release have not been fully optimized to their final values ? idram1 and idram2 are always enabled/retained for rom patch es and application development ? sdk5.0 enabl es clocks to different peripheral blocks to allow easier application development ? continuous access to the swd debug interface is needed. therefore, debug clocks cannot be turned off. a small sample measurement has been performed t hey show the following res ults: measurement condition: ? 1 - sec adverti si ng interval ? 37 byte advertising payload ? connectable beacon ? advertising on 3 chan nels (37,38,39) ? vbat and vddio are set to 3.3v ave rage advertising current: 13.65 a average slee p current between beacons: 2.00 a w ith vbat set to 3.6v, the average advertising current und er the same conditions is 12.67 a.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 5 25 13 document revision history doc rev. date comments 42498d 09/2016 1. revised figure 4 - 1 atsamb11 - mr210ca pinouts . 2. revised figure 4 - 2 pod drawing. 3. updated rtc drawings in figure 5 - 2 . 4. corrected khz to khz. 5. updated vddio current values in table 6 - 1 . 6. revised recommended operating conditions v oltage levels in table 5 - 2 . 7. for consistency, c orrected the reference name to be atsamb11 - mr210ca. 8. added module placement and keep out drawings in figure 8 - 1 and figure 8 - 2 . 9. revised m aximum ratings in table 5 - 1 . 10. revised ppm ratings in table 5 - 4 . 11. removed telec from the certifications. 12. updated fccid in section 11.1 . 13. revised feature numbers. 14. added te xt to absolute max ratings in section 5.1 to clarify. 15. updated the features, integrated power management section 16. added section 9.5 for module assembly c onsiderations . 17. revised document reference in section 10 . 18. added clearer reflow profile picture in figure 9 - 1 . 19. corrected footprint drawing in figure 4 - 3 . 20. minor edits. 42498c 02/2016 some minor corrections in text and layout. 1. added text referring to atsamb11 - mr510ca devices. 2. updated module drawing in figure 4 - 2 . 3. updated schematic information in section 7 and added revised application sche- matic figures to figure 7 - 1 and figure 7 - 2 . 4. revised reflow profile section 8 . 42498b 02/2016 1. changed pins in table 4 - 1 to add uart flow control . 2. added uart flow control requirement in chapter 7 . 3. updated application schematics in chapter 7 . 4. added agency certifications in chapter 11 . 5. added full module drawing in figure 4 - 2 . 6. revised table 6 - 1 to remove footnot e that is no longer applicable. 7. added application schematic bom in table 7 - 1 . 8. clearer reference schematic for atsamb11 - mr210 in figure 7.1 . 9. clearer bom for atsamb11 - mr210 in figure 7 - 2 . 10. added reference schematic in figure 7 - 3 . 11. added bom for atsamb11 - mr510 in figure 7 - 4 . 12. added comment to table 6 - 3 . 13. added errata ( chapter 12 ) . 42498 a 09/2015 initial document release.
atsamb11 - mr210ca/mr510ca [ datasheet ] atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 2 6 26 atmel corporation 1600 technology drive, san jose, ca 95110 usa t: (+1)(408) 441.0311 f: (+1)(408) 436.4200 www.atmel.com ? 2016 atmel corporation. / rev. atmel - 42498d - samb11 - mr210ca - mr510ca_datasheet_0 9 /2016 . atmel ? , atmel logo and combinations thereof, enabling unlimited possibilities ? , and others are registered trademarks or trademarks of atmel corporation in u.s. and other countries. arm ? , arm connected ? logo, cortex ? and others are the registered tradema rks or trademarks of arm ltd. other terms and product na mes may be trademarks of others. disclaimer: the information in this document is provided in connection with atmel products. no license, express or implied, b y estoppel or otherwise, to any intellect ual property right is granted by this document or in connection with the sale of atmel products. except as set forth in the atmel terms and cond itions of sales located on the atmel website, atmel assumes no liability whatsoever and disclaims any express, i mplied or statutory warranty relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or non - infringement. in no event shall atmel be liable for any direct, indirect, consequential, punitive, special or incidental damages (including, without limitation, damages for loss and profits, business interruption, or loss of information) arising out of the use or inability to use this document , even if atmel has been advised of the possibility of such damages. atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. atme l does not make any commitment to update the information contained herein. unless specifically provided otherwise, atmel products are not suitable for, and shall not be used in, auto motive applications. atmel products are not intended, authorized, or warra nted for use as components in applications intended to support or sustain life. safety - critical, military, and automotive applications discla imer: atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (safety - critical applications) without an atmel officer's specific written consent. safety - critical applications include, without limitation, life support devices and systems, equipment or systems for the operation o f nuclear facilities and weapons systems. atmel products are not designed nor int ended for use in military or aerospace applications or environments unless specifically designated by atmel as military - grade. atmel products are not designed nor intended for use in automotive applications unless specifically designated by atmel as automo tive - grade.

▲Up To Search▲

Price & Availability of ATATSAMB11-MR210CA

	To Download ATATSAMB11-MR210CA Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .